ASIG (Autocatalytic Silver / Immersion Gold) 
May 2010 

ASIG, the new nickel free process for final surfaces is now available. Outstanding bonding with aluminium and gold wire as well as excellent soldering compatibility. (Most suitable for flexible circuits with a confined radius.)

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Quality Control

March 2010

 

Two new CVS devices with autosampler, to determine the organic additives in copper baths and tin electrolytes, were taken into operation. This enables the organic additives to be kept in a narrow window for the different copper electrolytes.

 

 

 

 

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Chemical Nickel / Chemical Palladium /  Immersion Gold (ENEPIG)

August 2009

 

The application/process ENEPIG was introduced at the end of June. Excellent coating results can be achieved with the reductive palladium as an intermediate layer. This layer is also very well suited for soldering applications and aluminium wire bonding.

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Reel to Reel Copper plating

March 2009

 

The first 100 m polyimidfoil on a width of  610 mm with 5 µm copper plating was delivered to a customer. The base material was a 50 µm thick polimidfoil with approx 0.2 µm, using CVD applicated copper.

  

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Microfill 2

January 2009

 

Blind microvias filling and at the same time metallizing the trough holes.

This method is suitable for flexcircuits with blind microvias, ideally 80 – 100 µm diameter. The blind vias of rigid boards with aspect ratios up to 1:10 can be filled at the same time.

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